we understand your concern but as you said, we are using BGA package with 0.8mm pitch and very soon to lower pitch packages (0.5mm).
There is no plan to move back to higher pitch package.
We are trying to keep QFP version of our AT91SAM9 devices but it is not always possible to do so.

Best regards
Jean-Philippe
AT91 Support Team
>
> It's question to Atmel's package's designers.
>
>>> As i know, for powerful 32bit Atmel uP use tFBGA package .
>>> But uP in tFBGA very probably to route on PCB : that more hight
>>> cost and Marriage of PCB manufacturing
>>> For do this , PCB company must have hight exact equipment (min.
>>> diam. of via must be <= 0.2mm) and
>>> Atmel forever Has refused from senior models of a AT91sam9 series
>>> in standart BGA (pitch 1mm between pins) and QFP?
>>> Best regards,
>>> Sorry for my bad English .
>